Details About Tungsten Wire
When it comes to using tungsten wire, cracks, and brittleness are the enemies. And worse? They will be adversely affected by equipment stability and the production process.
Working with weak tungsten wires requires your production department to be on high alert. Any small mistake will cost you. The production team needs to strictly control the drawing temperature, speed, and processing variables. Also, sintering and forging play an important role in ensuring an efficient production process.
Typical Size Capabilities for Wire
Wire ( Coiled or Spooled) – Diameter of .0002” (.005mm) and up
Purity
When specified – 99.95%
Surface
1. Electro Polished finish
2. Alkaline Washing finish
3, Black finish
Applications for Pure Tungsten
. Manufacturing of electric light sources and electric vacuum parts
. Used as high-temperature heating elements and high-temperature structural parts
. Used to make tungsten spiral for vacuum evaporation
. For integrators, fume purifiers, electrostatic precipitators, air purifiers, printers, copiers, etc.
Flaw Detection

Yolo will have corresponding inspection for each process. 100% flaw detection to the 0.39mm thick wire end to confirm the crack. Under flaw detection, there are Grade A (eg: 2 crack points per 100 meters), B, C Grade. Any level wire below C will be removed, since the more cracks, the more easily the yarn are broken during processing.
Uniformity & Straightness
The quality difference of any two continuous 200 mm segments of tungsten wire does not exceed 0.5% of the nominal specification. For the tungsten wire ≤ 100um, the sag height of every 500mm shall be no less than 450mm;
For the tungsten wire ≥ 100um, the arc height per 100 mm chord length shall be ≤ 10 mm.
Drawing Process

Yolo’s advanced drawing equipment

There are many other manufacturers of traditional equipment
A rolling mill was introduced from Germany, which can deeply process the rod core, which can make the inside structure more uniform. Unlike the early traditional technology, are mainly surface processing.